ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Company codeIMOS
Company nameChipMOS Technologies Inc
IPO dateApr 19, 2013
Founded at1997
CEO- -
Number of employees- -
Security typeOrdinary Share
Fiscal year-endApr 19
AddressNo.1, Yanfa 1st Road, Hsinchu Science Park
CityBAOSHAN
Stock exchangeIraq Stock Exchange
CountryTaiwan
Postal code300
Phone88635770055
Websitehttps://www.chipmos.com/
Company codeIMOS
IPO dateApr 19, 2013
Founded at1997
A total of
301.29M
USD has been distributed in dividends over the past 5 years.
IMOS.NB Final Cash Dividend of gross USD 1.098163 paid on Jul 26, 2024 going ex on Jun 27, 2024
IMOS.NB Final Cash Dividend of gross USD 1.476772 paid on Jul 27, 2023 going ex on Jun 29, 2023
IMOS.NB Final Cash Dividend of gross USD 2.875965 paid on Jul 27, 2022 going ex on Jun 29, 2022
IMOS.NB Final Cash Dividend of gross USD 1.58188 paid on Sep 08, 2021 going ex on Aug 06, 2021
IMOS.NB Final Cash Dividend of gross USD 1.226742 paid on Aug 07, 2020 going ex on Jul 01, 2020