ACM Research, Inc. develops, manufactures, and sells production equipment and provides service solutions for single-wafer or batch wet cleaning, electroplating, stress-free polishing, plasma-enhanced chemical vapor deposition (PECVD), track and thermal processes. The Company offers two principal models of wet wafer cleaning equipment based on its Space Alternated Phase Shift (SAPS) technology, Ultra C SAPS II and Ultra C SAPS V. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional (3D) wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The Company also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers.
Company codeACMR
Company nameACM Research Inc
IPO dateNov 03, 2017
Founded at2016
CEOMr. Jian Wang
Number of employees2023
Security typeOrdinary Share
Fiscal year-endNov 03
Address42307 Osgood Rd Ste I
CityFREMONT
Stock exchangeNASDAQ Global Market Consolidated
CountryUnited States of America
Postal code94539-5062
Phone15104453700
Websitehttps://www.acmrcsh.com/
Company codeACMR
IPO dateNov 03, 2017
Founded at2016
A total of
0.00
USD has been distributed in dividends over the past 5 years.

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