ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Unternehmens-codeIMOS
Name des UnternehmensChipMOS Technologies Inc
IPO-datumApr 19, 2013
Gegründet am1997
CEO- -
Anzahl der mitarbeiter- -
WertpapierartOrdinary Share
GeschäftsjahresendeApr 19
AddresseNo.1, Yanfa 1st Road, Hsinchu Science Park
StadtBAOSHAN
BörseIraq Stock Exchange
LandTaiwan
Postleitzahl300
Telefon88635770055
Websitehttps://www.chipmos.com/
Unternehmens-codeIMOS
IPO-datumApr 19, 2013
Gegründet am1997
In den vergangenen 5 Jahren wurden insgesamt
301.29M
USD an Dividenden ausgeschüttet.
IMOS.NB Final Cash Dividend of gross USD 1.098163 paid on Jul 26, 2024 going ex on Jun 27, 2024
IMOS.NB Final Cash Dividend of gross USD 1.476772 paid on Jul 27, 2023 going ex on Jun 29, 2023
IMOS.NB Final Cash Dividend of gross USD 2.875965 paid on Jul 27, 2022 going ex on Jun 29, 2022
IMOS.NB Final Cash Dividend of gross USD 1.58188 paid on Sep 08, 2021 going ex on Aug 06, 2021
IMOS.NB Final Cash Dividend of gross USD 1.226742 paid on Aug 07, 2020 going ex on Jul 01, 2020